英属维尔京群岛巨沛有限公司

公司名称:英属维尔京群岛巨沛有限公司
所属地区:上海市厂商类型:封测厂商
公司网站:http://www.jipal.com

公司简介

巨沛股份有限公司成立於 1990 年 6 月,在董事長蔡進步先生的領導下,以前瞻性的眼光,提供客戶具高度競爭的產品及完整的售後服務。自創業以來,公司一貫秉持對半導體科技專業的技術以及對客戶誠信的原則,從事半導體封裝及測試, LED , Solar , SMT 等相關設備與材料的販售及售後服務。
巨沛股份有限公司對客戶的優良服務與原廠的密切配合,並榮獲多項客戶及原廠大獎,為了提供更好的服務給予客戶,在兩岸三地分別設立分公司以提供最即時且優質的服務,在全體員工共同努力勤奮踏實下穩健經營,並創造了「誠信」、「技術」、「服務」、「配合」的企業文化信念,而巨沛所堅持的信用與高度信心,以及對客戶的最佳服務品質保證,早已深獲客戶的肯定與支持。
巨沛人是一群兢兢業業並擁有半導體專業數十年經驗的菁英團隊所組成,我們重視客戶的品質與效率的提升,專業技能的訓練及規劃配合原廠技術的支援,以客戶導向為客戶提供最完善的售後服務及最佳的整體解決方案。秉持誠信對
待與努力打拼的精神,持續進步, 這是我們巨沛永續成長的原動力。

主要产品
Semiconductor

Fasford Technology / Japan
CM700 LOC & Window BGA Bonder.
DB830 Series Flexible Die Bonder.
TOWA Corporation / Japan
Auto Transfer Molding System Y- series , YPS , YPM1180.
Auto Compression Molding System PMC-D Series.
Auto Compression Molding System CPM1080, CPM1180 for Wafer & Panel Mold.
Package Singulation System FMS Series.
KLA-Tencor / U.S.A.
SWIFT Wafer Defect Inspection Altair 8800, 8900/ICOS WI 2280
 ICOS- Component Defect Inspection , CI-T830 Component Inspector, CI-T640 Component Inspector, CI-T120/T130/T220
Aurigin Technology / Singapore
Fully Automated BGA/CSP/FCBGA Solder Ball Placement System. (0.2mm pitch 0.15mm ball) au800/au800plus/au901c series.
Boat-to-Tray FCBGA Sorter bt215/bt218 series.
Hitachi High-Tech (TOHKEN) / Japan
12" Wafer X-Ray Inspection System MC-TUX8000.
Okamoto / Japan
GNX200B/300B Fully Automatic Wafer Grinder.
GNX8P/12P Polisher for Wafer Thinning Solution.
GDM300 Fully Automatic in-line Wafer Grinder & Polisher for thin wafer.
Teikoku Taping System / Japan
8/12" Wafer Mounter.
8/12" Tape, Dry Film Laminator & Tape Remover.
8/12" UV Irradiator
JHT / China
Exceed 6080H Pick & Place Test Handler.
Allteq Industrial / U.S.A.
Die Coater, Post W/B Inspection
Ishii Tool & Engineering / Japan
New Module Trim / Form System.
PAL / H.K.
Ni / Au & Copper Plating Line for Substrate.
KINERGY / Singapore
QFN Buffing Machine.
LED
TOWA Corporation / Japan

Auto molding System Y-series, YPS, YPM.
Auto Compression Molding System FFT & LCM Series.
Package Singulation System FMS Series.
Hitachi High-Tech (TOHKEN) / Japan
12" Wafer X-Ray Inspection System MC-TUX8000.
Okamoto / Japan
Sapphire Wafer Grinder SGL6.
Sapphire Ingot Grinder SiG62H
Sapphire Ingot Marker SiG6M.
Furukawa Electric / Japan
UV & Non-UV Tape for Wafer Dicing, Back Grinding.
UV Tape for Package Sawing Tape & Laser Wafer Dicing Tape.
Solar
Okamoto / Japan

Mono Crystal Squaring Machine SiS152H.
Ingot Grinder SiG154H.
Ingot Slicer / Grinder (Inline Type) SiSG156HT.
PAL / H.K.
MCP Solar Cell Pattem Plating Line.
SMT
Hover Davis / USA

The Feeder Expert
Tape and Reel Feeder.
Label Feeder.
KLA-Tencor / U.S.A.
ICOS-Component Defect Inspection CI-53 S/ Substrate Warpage Inspection , CI-T53 P/ Pre Stacking PoP Inspection, CI-T53 C/ Micro Crack Inspection
Materials
Alpha / USA & Singapore
Alpha ® Flux
Alpha ® Solder Paste
Alpha ® Solder Sphere.
Furukawa Electric / Japan
UV & Non-UV Tape for Wafer Dicing, Back grinding.
UV tape for package sawing tape & laser wafer dicing tape.
Die Attach Film Adhesives, DDAF & FOW.
M K ELECTRON / Korea
Gold Bonding Wire.
Copper Bonding Wire.
Silver Bonding Wire.