电子元器件资料和参数

元器件型号:WE-HL660DBW71-M2

功能特点

Descriptions:

● The Chip-LED Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.

● Besides, lightweight makes them ideal for miniature application,etc.

Features:

● Compatible with automatic placement equipment

● Compatible with reflow solder process

● Dice Material: InGaN

● Light Color: White

● Lens Color: Color Diffused

● Power Dissipation PD:1W

● Continuous Forward Current IFmax:350mA

● Peak Forward Current(1/10 Duty Cycle 0.1ms Pulse Width) IFP:400mA

● Reverse Voltage VR:5V

● Junction Temperature Tj:125℃

● Junction To Heat-Sink Thermal Resistance Rth:40℃/W

● Operating Temperature Range Topr:-40 to +85℃

● Storage Temperature Range Tstg:-40 to +85℃

Applications:

● Design and effect illumination

● Indicators

● LCD Back-lights

● Illuminations

大功率LED;LED及应用照明产品;SMD-LED

LED灯具;防爆灯具;工矿灯具;照明灯具设计;发光二极管