Descriptions:
● The Chip-LED Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
● Besides, lightweight makes them ideal for miniature application,etc.
Features:
● Compatible with automatic placement equipment
● Compatible with reflow solder process
● Dice Material: InGaN
● Light Color: White
● Lens Color: Color Diffused
● Power Dissipation PD:1W
● Continuous Forward Current IFmax:350mA
● Peak Forward Current(1/10 Duty Cycle 0.1ms Pulse Width) IFP:400mA
● Reverse Voltage VR:5V
● Junction Temperature Tj:125℃
● Junction To Heat-Sink Thermal Resistance Rth:40℃/W
● Operating Temperature Range Topr:-40 to +85℃
● Storage Temperature Range Tstg:-40 to +85℃
Applications:
● Design and effect illumination
● Indicators
● LCD Back-lights
● Illuminations
大功率LED;LED及应用照明产品;SMD-LED
LED灯具;防爆灯具;工矿灯具;照明灯具设计;发光二极管